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Automotive

Low-cost TFT instrument cluster with telematics

High-end automotive microcontrollers supporting basic or low-level 2D drawings are included on this board for the instrument cluster

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Artificial Intelligence

RZV2MA SMARC SOM

The RZ/V2MA is a state-of-the-art LSI (Large Scale Integration) chip equipped with a highly power-efficient AI accelerator (DRP-AI) and an OpenCV accelerator for pre/post AI processing, designed to optimize AI inference performance while minimizing power consumption (1 TOP/Watt) . Featuring dual Cortex-A53 CPU cores and extensive high-speed interfaces, this chip is ideal for advanced embedded AI applications.

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100W Power Supply with Multi-Output

The board is a 100W PD adapter with multiple outputs, providing a charging solutions for various devices on the go. It has fixed type A outputs and variable USB type C outputs upto 100W.

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Sensors

Smart HVAC Damper System with Environment Sensing

The Renesas Smart HVAC Damper System integrates cutting-edge technologies for precise control and monitoring of indoor air quality. At its core is the IPS2550 position sensor, which works in conjunction with the SLG47105 HVPAK to accurately position an air duct damper using a stepper motor. This system continuously tracks duct temperature, humidity, airflow, and air quality. The EK-RA2E1 microcontroller offers low power consumption and optimized peripherals, making it a versatile choice for various applications. The SLG47105-EVB features advanced PWM macrocells that enable control of multiple motors with adjustable frequencies and duty cycles, enhancing operational flexibility.

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Industrial Automation

Digital Power Monitor using IO-LINK

IO-Link is a globally recognized open-standard protocol designed for industrial automation and communication. It enables seamless two-way data exchange between a master device, sensors, and actuators, making it an essential component in modern industrial systems. The protocol also supports applications in power monitoring, where precise current and voltage measurements are critical for operational efficiency. Additionally, the system facilitates rapid prototyping and evaluation using Pmod™ boards, providing enhanced flexibility for embedded system development and automation solutions. This robust ecosystem combines the advantages of IO-Link communication, dynamic power monitoring, and rapid prototyping to advance industrial automation and embedded system development.

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Industrial

E-Mobility Solutions -Motor Drive + BMS

High-voltage power train system with modularly integrated wired/wireless charging (ISL81801 and P9415), battery management system (ISL94216), and optional Bluetooth wireless connectivity (RX23W)

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Power and Energy

High Power BLDC Control Solution

CN024 High Power Full Range Sensorless FOC Motor Solution is for BLDC/PMSM sensorless drive systems equipped with RA4T1 and related products from Renesas Electronics. CN024 High Power Full Range Sensorless FOC Motor Solution consists of three boards including a controller board equipped with RA4T1, an inverter board and a communication board.

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Communication and Computing Infrastructure

Face Recognition & 2D Barcode Type Detector Solution

The RZ/A2M Evaluation Kit is a best-in-class evaluation board kit used for evaluating the RZ/A2M high-speed, embedded AI-based, image processing microprocessors with Dynamically Reconfigurable Processor (DRP) technology. A MIPI camera module, display output board for display connection and an on-chip debugging emulator (Segger J-Link Lite) are included, so you can start evaluation immediately. The onboard device is the RZ/A2M (R7S921053VCBG: with DRP function, internal RAM 4MB) and evaluation of the DRP is possible.

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Key Technologies

Mbed™ Based Image Processing Solution

The RZ/A2M MPU features an Arm® Cortex®-A9 CPU and is designed for e-AI based imaging that requires high-speed image processing with Dynamically Reconfigurable Processor (DRP) Technology. You can try the image processing by editing MicroPython code on the lab. This image processing solution enables rapid-prototyping for a smart camera that includes a smart display, network capabilities, storage, an audio jack, and interfaces for sensors.

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